To prevent heat sock and performance decline due to heat generated from CPU, module, IC
and transistor used in electronic devices of recent electronics and communication area.
- Electric/ Electronic Sub Assembly of Automobile
- Home appliances (PDP, LCD and Mobile Phone etc.)
- CD-ROM, DVD Cooling
- RDRAM Modules
- Wafer equipments
It is used for the purpose of insulation and radiation of heat of severe heating parts.
- - LED lamp